Browse Prior Art Database

Enhancement of Fine Pitch Flip Chip Interconnection by Using Thin Soldermask

IP.com Disclosure Number: IPCOM000006690D
Original Publication Date: 2002-Jan-23
Included in the Prior Art Database: 2002-Jan-23
Document File: 2 page(s) / 36K

Publishing Venue

Motorola

Related People

Authors:
Burt Carpenter Brian Sawyer Bill Stone Trent Uehling

Abstract

Enhancement of Fine Pitch Flip Chip Interconnection by Using Thin Soldermask