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Enhanced Reliability of Flip Chip Packages with Organic Substrates by Using Crack Propagation Barriers

IP.com Disclosure Number: IPCOM000006691D
Original Publication Date: 2002-Jan-23
Included in the Prior Art Database: 2002-Jan-23
Document File: 1 page(s) / 54K

Publishing Venue

Motorola

Related People

Authors:
Bill Stone

Abstract

Enhanced Reliability of Flip Chip Packages with Organic Substrates by Using Crack Propagation Barriers