GRADE MARKING OF TESTED WAFER-LEVEL SEMICONDUCTOR DIE VIA PHOTORESIST
Original Publication Date: 1992-Dec-01
Included in the Prior Art Database: 2002-Jan-24
Process variations and defects (random and system- atic) necessitate that semiconductor wafers be electri- cally tested to identify defective die. Traditionally, these reject die have been marked with an ink dot to indicate at package assembly that such die are defective and must not be assembled.