METHOD TO OBTAIN FLAT TOP GLOB CARRIER FOR HIGH SPEED PLACEMENT
Original Publication Date: 1992-Dec-01
Included in the Prior Art Database: 2002-Jan-25
Coplanar or "dome" shape IC packages using stand- ard epoxy dispensing techniques for chip carriers has always been a concern for placement accuracy. Typical epoxy dispensing has always been directly onto a PC mother board and not a chip carrier due to camber and cost concerns. This technical Motorola Publication will describe a new technique in obtaining "flat top" carriers to provide accurate placement via robot placement cells or chip mounters.