Browse Prior Art Database

LEAD FRAME DESIGN FOR FINE PITCH WIRE BONDING

IP.com Disclosure Number: IPCOM000006727D
Original Publication Date: 1993-Mar-01
Included in the Prior Art Database: 2002-Jan-25
Document File: 2 page(s) / 125K

Publishing Venue

Motorola

Related People

Authors:
John Baird

Abstract

High lead count IC packages require tine pitch wire bonding. The design and processing of a blanked or etched lead frame for a quad flat pack is presented that gives the required wire post pitch, and adequate lead-to- lead clearance. A lead frame design for tine pitch wire bonding is shown in Figure 1 and 2, attached.