LOW THERMO-MECHANICAL STRESS FLIP CHIP BUMPS
Original Publication Date: 1993-Mar-01
Included in the Prior Art Database: 2002-Jan-30
One of the most important reliability issues in flip chip packaging is the thermo-mechanical stress which is caused by the mismatch of the coefficients of thermal expansion (CTE) between the chip and the substrate. This thermo-mechanical stress can be reduced either by using a substrate material whose CTE matches the device (Si or GaAs) or by increasing the spacing between the chip and the substrate.