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LOW THERMO-MECHANICAL STRESS FLIP CHIP BUMPS

IP.com Disclosure Number: IPCOM000006759D
Original Publication Date: 1993-Mar-01
Included in the Prior Art Database: 2002-Jan-30

Publishing Venue

Motorola

Related People

Authors:
Jong-Kai Lin Bill Lytle Tom Scharr Ravi Sharma Ravi Subrahmanyan

Abstract

One of the most important reliability issues in flip chip packaging is the thermo-mechanical stress which is caused by the mismatch of the coefficients of thermal expansion (CTE) between the chip and the substrate. This thermo-mechanical stress can be reduced either by using a substrate material whose CTE matches the device (Si or GaAs) or by increasing the spacing between the chip and the substrate.