AUTOMATIC SOLDER FEEDING PTH DESIGN FOR CLADDED PCB
Original Publication Date: 1993-Mar-01
Included in the Prior Art Database: 2002-Jan-30
The latest development in the PCB industry is the introduction of cladded boards. This is a process whereby a PCB, after the normal tin-lead coating on the solder pads, is printed with solder paste on these pads and reflowed without any component on it (hereafter referred as cladding reflow process). As the paste melts and resolidifies, it forms solder bumps on the solder pads which hold a controlled amount of solder on them. This is called a cladded PCB. Subsequently, the cladded PCB will be reflowed with components on it witho& further application of solder paste (hereafter referred as com- ponents reflow process). Cladded PCBs are usully done at the PCB manufacturer's site and hence their custom- ers can immediately use the boards for components reflow process without the need to print solder paste on them.