METHOD OF PRINTED CIRCUIT BOARD HOLD DOWN FOR WIREBONDING AND DISPENSING
Original Publication Date: 1993-Mar-01
Included in the Prior Art Database: 2002-Jan-31
In the past, manual workholders to hold down ceramic substrates for wirebonding has shown to be ben- eficial to obtain proper wirebonding results. Improving on prior art, a new flexible workholder was developed for various types of PCB substrates. The PC board arrays, used for glob top chip carriers, have different routing patterns due to the chip carrier size. The past workholders were not flexible to remove and accommodate the vari- ous arrays used during processing. This publication will describe a new technique in obtaining a flexible workholder that can be used with various routed arrays, providing increased reliability in wirebond integrity and reducing change over time.