SURFACE MOUNT REFLOWABLE INDIVIDUAL SOCKETS
Original Publication Date: 1993-Mar-01
Included in the Prior Art Database: 2002-Feb-01
Leaching of the lead pads due to repeated reflow temperature exposure. While initially reflowing the cir- cuit board (hybrid) the lead pads are exposed to reflow temperatures. When the leads are attached the lead pads are again#exposed to reflow temperatures when the hybrid is "dipped" into a solder pot (an uncontrolled process). When the circuit board is attached to the mother board the leads, which were attached by dipping, are inserted into through holes in the mother board and the entire assembly is wavelme soldered. This once again exposes the lead pads to reflow temperatures. This triple expo- sure to reflow temperatures contributes to a weakening of the lead pad attachment to substrate known as "leaching? These now potentially weakened bonds are further stressed during subsequent processing when the circuit boards with lead attachments are "bent" out of the way to gain access to adjoining areas.