DUAL DSP96002 MULTIPLE BUS ACTIVE SILICON SUBSTRATE MULTICHIP MODULE
Original Publication Date: 1993-Mar-01
Included in the Prior Art Database: 2002-Feb-01
The numerous inquiries in reference to our DSP Multichip Module projects have unveiled a tremendous problem. Every customer has a diierent systems archi- tecture that they would lie to implement into a module to match their specific application, yielding an exhorbitant amount of possible MCM's we may produce and rais- ing the question of whether each module is generic or custom. We cannot afford to produce all of the MCM's our customers need, yet we need to be their solution. Another major issue involving MCM's is testability Each microprocessor and memory block must have the capa- bility of being exposed to ease the testability issue. Yet, most of the architectures submitted by our customers do not allow direct access to the internal components.