THERMALLY ACTIVATED ATTACHMENT MECHANISM
Original Publication Date: 1993-Mar-01
Included in the Prior Art Database: 2002-Feb-05
Surface mount devices depend on solder for mechan- ical stability. One cause of surface mount device failure occurs from solder fatigue due to mechanical stresses applied to the solder joint. The purpose of the Thermally Activated Attachment Mechanism is to solve the prob- lems associated with achieving reliable structural integ- rity of surface mount devices to printed wiring boards.