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Method for BGA attachment utilizing a solder fillet for large, high stiffness, low CTE packages

IP.com Disclosure Number: IPCOM000006851D
Publication Date: 2002-Feb-06

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for ball grid array (BGA) attachment using a solder fillet for large, high stiffness, low CTE packages. Benefits include reduced complexity and decreased cost.