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Method of providing mechanical support for a peripheral array BGA package with land-side capacitors to ensure compatibility with a PGA package

IP.com Disclosure Number: IPCOM000006852D
Publication Date: 2002-Feb-06

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method of providing mechanical support for a peripheral ball grid array (BGA) package with land-side capacitors (LSCs) to ensure compatibility with a pin grid array (PGA) package. Benefits include improved functionality and improved reliability.