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Method for variable land pitch to reduce interconnect misalignment caused by differences in thermal expansion rates in electronic packages and circuit boards

IP.com Disclosure Number: IPCOM000006853D
Publication Date: 2002-Feb-06
Document File: 3 page(s) / 57K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for variable land pitch to reduce interconnect misalignment caused by differences in thermal expansion rates in electronic packages and circuit boards. Benefits include improved thermal performance.