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Disclosed is a method for a direct solder attachment of two or more printed circuit boards without a connector. Benefits include improved productivity, improved quality, and improved reliability.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
69% of the total text.
Disclosed is a method for a direct solder attachment of two
or more printed circuit boards without a connector
Disclosed is a method for a direct solder attachment of two or
more printed circuit boards without a connector. Benefits include improved productivity,
improved quality, and improved reliability.
demands require packaging options to reduce the size and volume of circuit
assemblies. Standard industry practice is to create multiple circuit boards and
mate them using connectors, which are soldered to the board. The connectors add
cost to the product and decrease its quality and reliability.
Interconnection between circuit
assemblies is conventionally accomplished by connectors and/or cables. For
example, a female connector is solder attached to one circuit board. The second
circuit board has edge contacts, which insert into the female connector.
The disclosed method provides
interconnection between printed circuit boards without connectors (see Figure
1). The key elements of the method include:
solder attachment of two or more circuit boards
side wave or manual soldering
in main circuit board receives daughter card
between boards is achieved through tolerance alignment and retention features
• Alignment hole or slot
that may be plated and subsequently soldered for power delivery or ground
depth is controlled be daughter card shoulders