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Method for an integrated heat spreader design with gold-plated nodules to control bond-line thickness for solder interface materials

IP.com Disclosure Number: IPCOM000006890D
Publication Date: 2002-Feb-08

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an integrated heat spreader (IHS) design with gold-plated nodules to control bond-line thickness (BLT) for solder interface materials. Benefits include improved reliability, ease of manufacturing, and thermal performance.