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Disclosed is a method for a heat-spreader design to minimize warpage for improved case-to-heatsink transfer. Benefits include improved thermal performance and improved yield.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
67% of the total text.
Method for a heat-spreader design to minimize warpage for
improved case-to-heatsink transfer
Disclosed is a method for a heat-spreader design to minimize
warpage for improved case-to-heatsink transfer. Benefits include improved
thermal performance and improved yield.
The conventional heat-spreader design
is comprised of an integrated heat spreader (IHS), a thermal interface material
(TIM) layer, a die, and sealant (see Figure 1). IHS warpage is caused by a load
applied to the heat spreader that bends the substrate. Warpage causes increased
thermal resistance. No conventional solution exists for this problem.
method optimizes the
heat-spreader design to reduce thermal resistance by subjecting the IHS to
bending that results in a flat heat spreader after assembly is complete.
the assembly process, the heat spreader is subjected to 3-point bending that
results in a concave warpage (see Figure 2) caused by the heat spreader
material, size, thickness, and spring-clip force. This warpage results in
increased case-to-heatsink thermal resistance due to increased bond line
thickness (BLT) of the thermal grease or phase-change material applied to the
base of the heatsink. Manufacturing the heat spreader with reversed (convex)
warpage results in a flat heat spreader post assembly (see Figure 3).
calculations of the heat spreader warpage are determined from Equation 1 (see
Figure 4). Analytical results (see Figure 5) matched empiric...