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CROSS HATCHED PAD DESIGN FOR BONDING EL PANELS TO PCB'S USING Z-AXIS ADHESIVES

IP.com Disclosure Number: IPCOM000006966D
Original Publication Date: 1993-Jun-01
Included in the Prior Art Database: 2002-Feb-13

Publishing Venue

Motorola

Related People

Authors:
Frank Juskey Arnold Hogrefe

Abstract

Ditliculties can often be encountered when bondine electroluminescent (EL) panels to PC boards because of the solid gold plane design of the pads. Gold is a noble metal and resists bond formation with almost all substances. Because of gold's inert properties, it is used so that it won't oxidize and cause the EL panel to become intermittent or not light. Many problems have been seen with the current PCB supplier shipping boards with con- taminated bonding pads. The combination of process related contamination and gold's noble bonding proper- ties make it very difficult for the EL panel to be bonded to the board.