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INTEGRAL DIE SUPPORT AND DOWNSET FIXTURE FOR TAB INNER LEAD

IP.com Disclosure Number: IPCOM000006996D
Original Publication Date: 1993-Oct-01
Included in the Prior Art Database: 2002-Feb-15

Publishing Venue

Motorola

Related People

Authors:
Peter Cole

Abstract

The use of Tape Automated Bonding (TAB) is a packaging alternative which is finding increasing application for high density/fine pad pitch devices. TAB packaging consists of a leadframe on a plastic substrate (such as kapton) which is bonded to a die using either a "gang" or "single point" bonding proc- ess (Figure 1).