NEW METHOD/TOOL FOR GENERATING ASIC PACKAGE PIN ASSIGNMENTS
Original Publication Date: 1993-Oct-01
Included in the Prior Art Database: 2002-Feb-19
Motorola ASIC offets several families ofmacrocell arrays. Most of these have a predefined set of pack- ages available. The bonding arrangement (die pad to package pin) is pre-assigned at the factory for each array/package combination in the general offering. Input/Output buffers are composed of transistors present in predetined I/O sites. The relationship from a given I/O site to die pad is also predefined. Users assign an I/O signal to a specific package pin by placing the corresponding I/O buffer on the site driving/driven by the bonding pad (bonded out to the package pin in question).