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STRAY DEPOSITION SHIELD

IP.com Disclosure Number: IPCOM000007043D
Original Publication Date: 1993-Oct-01
Included in the Prior Art Database: 2002-Feb-20

Publishing Venue

Motorola

Related People

Authors:
John Hawkins Ray Campos

Abstract

Stray metal deposition inside metal sputtering equipment has always been a problem and'SF1 (Sputtered Films Inc.) equipment is no exception. A gap between the chuck and the gate valve shield allowing metal to be deposited on the gate valve seating surface, creating leaks when the chuck opens and behind the chuck, being deposited on the chuck bellows and the chuck back plate. This becomes a problem with out-gassing, affecting pump down and reflectivity. The other area that had stray metal dep- osition was the chamber walls, by way of another gap where the chamber shield mates to the gate valve shield, allowing metal to be deposited on the cham- ber walls. (Figure 1).