Dismiss
InnovationQ and the IP.com Prior Art Database will be updated on Sunday, December 15, from 11am-2pm ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

BENDING AND USING TUNGSTEN NEEDLES FOR ELECTRICAL CONTACTS ON BUMP PROCESS PLATING HOODS

IP.com Disclosure Number: IPCOM000007064D
Original Publication Date: 1993-Oct-01
Included in the Prior Art Database: 2002-Feb-22

Publishing Venue

Motorola

Related People

Authors:
Robert L. Kelley, Jr. M. Carmen Brown

Abstract

The 5 inch bump plating process for flip chip was experiencing non-plating and missing plating on bumped wafers. The wafers with non-plated bumps are scrapped.