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BENDING AND USING TUNGSTEN NEEDLES FOR ELECTRICAL CONTACTS ON BUMP PROCESS PLATING HOODS

IP.com Disclosure Number: IPCOM000007064D
Original Publication Date: 1993-Oct-01
Included in the Prior Art Database: 2002-Feb-22

Publishing Venue

Motorola

Related People

Authors:
Robert L. Kelley, Jr. M. Carmen Brown

Abstract

The 5 inch bump plating process for flip chip was experiencing non-plating and missing plating on bumped wafers. The wafers with non-plated bumps are scrapped.