Browse Prior Art Database

APPARATUS/METHOD TO CONTROL FILL RATE OF MOLDED PACKAGE WITH CARRIER RING

IP.com Disclosure Number: IPCOM000007069D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2002-Feb-22

Publishing Venue

Motorola

Related People

Authors:
Cliff J. Scribner James H. Knapp

Abstract

Transfer molding technology, especially in the semiconductor field, has advanced dramatically in the last decade. Despite the advancements, one of the great challenges continues to be accommodat- ing traditional manufacturing techniques with more complex package configurations.