Browse Prior Art Database

APPARATUS AND METHOD FOR CHANGING A WAFER DICING CHUCK

IP.com Disclosure Number: IPCOM000007070D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2002-Feb-22
Document File: 1 page(s) / 49K

Publishing Venue

Motorola

Related People

Authors:
Rinjiro Kohno Hiroyuki Tatsuno

Abstract

Semiconductor wafers are cut into chip size using a wafer dicing machine. The Semiconductor water is placed on a dicing chuck which is otten screwed into a dicing table. A vacuum is placed on the wafer from inside the dicing chuck (originating from the dicing table). With the constant pounding and cut- ting performed on the chuck, maintenance is required and the chuck must be unscrewed from the dicing table.