APPARATUS AND METHOD FOR CHANGING A WAFER DICING CHUCK
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2002-Feb-22
Semiconductor wafers are cut into chip size using a wafer dicing machine. The Semiconductor water is placed on a dicing chuck which is otten screwed into a dicing table. A vacuum is placed on the wafer from inside the dicing chuck (originating from the dicing table). With the constant pounding and cut- ting performed on the chuck, maintenance is required and the chuck must be unscrewed from the dicing table.