Dismiss
InnovationQ and the IP.com Prior Art Database will be updated on Sunday, December 15, from 11am-2pm ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

WIRE BOND TOOLING FOR RIGID-SUBSTRATE DUAL-SIDED MCM-L PACKAGES

IP.com Disclosure Number: IPCOM000007114D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2002-Feb-26

Publishing Venue

Motorola

Related People

Authors:
Harold Anderson

Abstract

In front-end packaging assembly of integrated circuits (IQ the process of wire bonding is one method by which electrical interconnects are made between the chip and the package.