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Method for a bending-shock test procedure with an angled BGA layout on a test coupon

IP.com Disclosure Number: IPCOM000007120D
Publication Date: 2002-Feb-26

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a bending-shock test procedure with an angled BGA layout on a test coupon. Benefits include improved circuit board design, improved testing, and improved FEA modeling.