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Disclosed is a method for a bending-shock test procedure with an angled BGA layout on a test coupon. Benefits include improved circuit board design, improved testing, and improved FEA modeling.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
52% of the total text.
Method for a bending-shock test procedure with an angled
BGA layout on a test coupon
Disclosed is a method for a bending-shock test procedure with an
angled BGA layout on a test coupon. Benefits include improved circuit board
design, improved testing, and improved FEA modeling.
The disclosed method calculates
the dynamic failure strength of the corner solder joint of the corner ball
through the finite element analysis (FEA) and applies dynamic failure criterion
to the design of a ball grid array (BGA), heatsink, and other enabling parts on
proposed test setup includes a 4-point bending shock test (see Figure 1) but
may include a 3-point or other bending (see Figure 2) test. The 4-point bending
test reduces the sensitivity of the package location on the test coupon.
The disclosed test board
design is an 8-inch by 4-inch PCB (not limited to that size) and a rectangular
BGA (not limited to that shape) mounted at the center of the PCB with its long
diagonal parallel to the PCB long edge (see Figure 3b). For a square BGA, its
edge is rotated 45 degrees with respect to the PCB edges (see Figure 4). This
setup ensures that the first solder joint failure occurs at the corner of the
strain gage, LVDT and other sensors are mounted at various locations to monitor
displacement, strain, strain rate, and acceleration during the shock test. The
fracture of the solder joint is monitored by the daisy-chain continuity and,
possibly, any significant s...