Browse Prior Art Database

PACKAGING NON-SMT COMPONENTS

IP.com Disclosure Number: IPCOM000007125D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2002-Feb-27

Publishing Venue

Motorola

Related People

Authors:
Christopher Walvoord Jeff Pflug Pat McGovern

Abstract

The JCP Box provides a robust method ofpack- aging non-surface mount components in an other- wise all surface mount package such as a PolyBent" module. The JCP Box provides an effective seal, excellent vibration support, and a relatively simple attachment method for non-smt components such as large torroids and capacitors. The JCP Box also reuses a great deal of connector technology in order to minimize the risks inherent in any new design.