LOAD BEARING SOLDER SURFACE FOR COPPER PLATED GRAPHITE CARRIERS
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2002-Feb-27
Recent RF Power Amplifier designs employ cop- per plated graphite plates as carriers for the RF power transistors and their matching circumy. This tech- nology allows ceramic substrates to be soldered directly to the copper plated graphite carrier, pro- viding a electrical and thermal interface superior to historical non-soldered approaches. What makes this possible is the fact that graphite can be affordably manufactured with a similar CTE to ceramic.