Browse Prior Art Database

SPUTTER-DEPOSITION COVER SHIELDS

IP.com Disclosure Number: IPCOM000007131D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2002-Feb-27

Publishing Venue

Motorola

Related People

Authors:
Michael A. Contreras

Abstract

Currently, most metals are deposited onto sili- con wafers using sputter-deposition equipment. Some sputter deposition equipment has multiple sputtering chambers, such as the Varian 3180'" and 3190" made by Varian Associates of Palo Alto, California. Although the sputtering chamber stations should act relatively independent ofeach other, some metal from a target within one station may "overspray" into an adjacent station during a sputter deposition step. The overspray results in an accumulation of metal within the adjacent, sputtering station. The overspray requires additional cleaning of the oversprayed sputtering station even though it may be unused.