Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2002-Feb-27
The invention of three dimensional circuits has complimented today's emphasis on ever more com- pact packaging designs. Two traditional methods of transferring 3-D circuits to plastic components are double shot molding, and photo imaging. The first involves injecting a catalytic plastic (platable) into a non-catalytic previously molded base. The part is then subjected to a series of plating processes, The second method is photo imaging which is charac- terized by a series of plating, masking, and etching operations. The proposed method has several advan- tages over these complex traditional methods.