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Disclosed is a method for an improved integrated heat spreader (IHS) to package adhesion by designing a locking structure for the epoxy sealant material. Benefits include improved thermal performance.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
55% of the total text.
Method for an improved IHS to package adhesion by designing
a locking structure for the epoxy sealant material
Disclosed is a method for an improved integrated heat spreader
(IHS) to package adhesion by designing a locking structure for the epoxy sealant
material. Benefits include improved thermal performance.
detachment can occur in a conventional large-die application because of poor
wetting or adhesion between the IHS and the sealant (see Figure 1). The planar
interface enables the crack /delamination to progress without resistance.
detachment from the epoxy sealant material is a major problem encountered
during reliability testing of test vehicles during package development. High
bending and shear stresses are due to the mismatch in the coefficient of
thermal expansion (CTE) between the copper IHS and the organic package
substrate. IHS detachment causes thermal interface material (TIM) delamination
and results in degradation of the thermal resistance of the TIM. No conventional
solution exists for large die applications. A task force is evaluating process
changes to improve the adhesion strength between the IHS and the epoxy sealant
The disclosed method includes a
locking structure designed on the IHS edge that is attached to the package
substrate with an epoxy sealant material. The locking structure enables
increased contact area between the sealant and the IHS. Detachment can only
occur if the epoxy sealant tears from the lockin...