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Method for an improved IHS to package adhesion by designing a locking structure for the epoxy sealant material

IP.com Disclosure Number: IPCOM000007138D
Publication Date: 2002-Feb-27
Document File: 3 page(s) / 76K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an improved integrated heat spreader (IHS) to package adhesion by designing a locking structure for the epoxy sealant material. Benefits include improved thermal performance.