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Method for forming a package with high thermal conductivity that enables heat extraction from the front and back of an IC chip

IP.com Disclosure Number: IPCOM000007140D
Publication Date: 2002-Feb-27

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for forming a package with high thermal conductivity that enables heat extraction from the front and back of an IC chip. Benefits include improved thermal performance.