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Method for rapid cure of thermoset heatsink adhesive using hotplate preheating

IP.com Disclosure Number: IPCOM000007145D
Publication Date: 2002-Feb-27
Document File: 5 page(s) / 86K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for rapid cure of thermoset heatsink adhesive using hotplate preheating. Benefits include improved reliability and improved thermal performance.