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Method for increasing interfacial crack resistance at the die/TIM interface by dimpling the die backside with laser milling

IP.com Disclosure Number: IPCOM000007149D
Publication Date: 2002-Feb-27

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for increasing interfacial crack resistance at the die/TIM interface by dimpling the die backside with laser milling. Benefits include improved thermal performance and improved reliability.