A NOVEL HIGH FREQUENCY BOND WIRE INTERFACE
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2002-Feb-28
This paper describes a novel method of approach- ing the problem of bond wire interfaces for transi- tions to microwave and millimeter-wave hardware. In general, Monolithic Microwave Integrated Cir- cuits (MMICs), and Multi-Chip Modules (MCMs), make their electrical connections using wire bonds. However, these wire bonds present a significant induc- tive circuit parasitic at Microwave and millimeter- wave frequencies, thus making the design more dif- ficult. The bond wire interface described here takes advantage of the inductive circuit parasitic of the bond wire to create a controlled third order low-pass fil- ter structure.