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Browse Prior Art Database

WATER SEAL CHUCK FOR POLISHING OF SEMICONDUCTOR WAFERS

IP.com Disclosure Number: IPCOM000007174D
Original Publication Date: 1994-Jun-01
Included in the Prior Art Database: 2002-Mar-01
Document File: 1 page(s) / 72K

Publishing Venue

Motorola

Related People

Authors:
Otto Luedke Fernando Bello Cindy Welt

Abstract

Wafers are typically polished on a Robot Assisted Polish Systems (RAPS) one wafer at a time to give maximum control of the flatness of each individual wafer and are supported by a flat rigid vacuum chuck during the polish operation.