Browse Prior Art Database

REPLACEABLE COVER PLATE TO REDUCE MOLDED PACKAGE RESIN BLEED

IP.com Disclosure Number: IPCOM000007203D
Original Publication Date: 1994-Jun-01
Included in the Prior Art Database: 2002-Mar-05
Document File: 4 page(s) / 261K

Publishing Venue

Motorola

Related People

Authors:
Cliff J. Scribner James H. Knapp

Abstract

Transfer molding technology, especially in the semiconductor field, has advanced dramatically in the last decade. Despite the steady advancements, one of the great challenges continues to be accom- modating traditional manufacturing techniques with packages having more complex configurations, larger physical dimensions and asymmetrical internal pack- age geometry's, Several mold related projects facing this chal- lenge are currently in the development stage at the Motorola Semiconductor Products Sector Chandler facility. One particular project is the Pilot Line pro- duction of the AC Ring Quad Flat Pack (40x40 mm) plastic Micro-Cool package, including the family of package variations. The package is molded with thermoset epoxy either in a 232 or 304 lead contig- uration. Both configurations include a molded car- rier ring that is formed outside the molded package body, Some versions include a heat sink that pro- vides enhanced thermal performance while others are ofthe Multi-Chip-Module (MCM) configuration.