REPLACEABLE COVER PLATE TO REDUCE MOLDED PACKAGE RESIN BLEED
Original Publication Date: 1994-Jun-01
Included in the Prior Art Database: 2002-Mar-05
Transfer molding technology, especially in the semiconductor field, has advanced dramatically in the last decade. Despite the steady advancements, one of the great challenges continues to be accom- modating traditional manufacturing techniques with packages having more complex configurations, larger physical dimensions and asymmetrical internal pack- age geometry's, Several mold related projects facing this chal- lenge are currently in the development stage at the Motorola Semiconductor Products Sector Chandler facility. One particular project is the Pilot Line pro- duction of the AC Ring Quad Flat Pack (40x40 mm) plastic Micro-Cool package, including the family of package variations. The package is molded with thermoset epoxy either in a 232 or 304 lead contig- uration. Both configurations include a molded car- rier ring that is formed outside the molded package body, Some versions include a heat sink that pro- vides enhanced thermal performance while others are ofthe Multi-Chip-Module (MCM) configuration.