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MULTI-LAYER CAPACITOR Disclosure Number: IPCOM000007227D
Original Publication Date: 1994-Jun-01
Included in the Prior Art Database: 2002-Mar-06

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Yeo-Hwan Yang Shu-Wu Chiu Dan Lamey


A novel approach to integrate MonoSolicon Capacitor (MSC) and Double Poly Capacitor (DPC) processes to achieve capacitance up to 3.1 ff/urn2 is proposed. Higher capacitance may be possible with thinner dielectric thickness.