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A Method for Making Single-Sided or Asymmetrical Build-Up IC Package Substrates by Using Dielectric Seal and Sacrificial Injection Molded Plastic Picture Frames

IP.com Disclosure Number: IPCOM000007237D
Publication Date: 2002-Mar-06

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses dielectric films and picture frame plastic to temporarily join core panels of two substrates prior to adding symmetric build-up layers on both sides of the combined core panels. Benefits include minimizing the cost of the substrate by reducing the number of layers.