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Method for a BBUL package with two-sided heat removal

IP.com Disclosure Number: IPCOM000007238D
Publication Date: 2002-Mar-06
Document File: 7 page(s) / 877K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a bumpless build-up layer (BBUL) package with two-sided heat removal. Benefits include improved thermal performance.