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Method for a process carrier spring that provides two-point contact on the substrate for greater retention within the carrier pocket

IP.com Disclosure Number: IPCOM000007241D
Publication Date: 2002-Mar-06
Document File: 5 page(s) / 212K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a process carrier spring that provides two-point contact on the substrate for greater retention within the carrier pocket. Benefits include improved performance, improved reliability, and reduced defects.