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Method for a compliant BGA perimeter gasket to reduce mechanical stress and thermal interface material spillage

IP.com Disclosure Number: IPCOM000007245D
Publication Date: 2002-Mar-06
Document File: 4 page(s) / 41K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a compliant ball grid array (BGA) perimeter gasket to reduce mechanical stress and thermal interface material (TIM) spillage. Benefits include improved quality and improved thermal performance.