SILICON WAFER THINNING AND DICING ROUND OR NON ORTHOGONAL DIE USING DRY ETCHING
Original Publication Date: 1994-Oct-01
Included in the Prior Art Database: 2002-Mar-08
This paper describes a novel method of Silicon wafer thinning and etching round or non orthogo- nal shapes using a dry etch system. There are sev- eral types of dry etch systems on the market today. The most efficient systems are the microwave radi- cal generators. In addition this type ofsystem imparts little or no radiation damage to the material being etched.