Browse Prior Art Database

SILICON WAFER THINNING AND DICING ROUND OR NON ORTHOGONAL DIE USING DRY ETCHING

IP.com Disclosure Number: IPCOM000007267D
Original Publication Date: 1994-Oct-01
Included in the Prior Art Database: 2002-Mar-08
Document File: 1 page(s) / 81K

Publishing Venue

Motorola

Related People

Authors:
David Shumate Hiep Le Garty Vick Bill Wasmer

Abstract

This paper describes a novel method of Silicon wafer thinning and etching round or non orthogo- nal shapes using a dry etch system. There are sev- eral types of dry etch systems on the market today. The most efficient systems are the microwave radi- cal generators. In addition this type ofsystem imparts little or no radiation damage to the material being etched.