PCB BASED QFP WITH AREA ARRAY TEST CONTACTS- A TRANSITIONAL PACKAGE FROM QFPS TO BGAS
Original Publication Date: 1994-Oct-01
Included in the Prior Art Database: 2002-Mar-08
A new package design methodology for high pincount printed circuit board based QFP packages has been developed which has two unique benefits. First, this PCB design enables a low risk customer package conversion from a peripheral leaded QFP to an area array BGA, using the identical board design. Second, this design concept enables the use of an alternate electrical test method for PCB based QFP packages by making electrical contact through the robust BGA pads instead ofthe QFP leads.