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Method for the use of an autoclave for improved wafer bonding and increased manufacturing throughput

IP.com Disclosure Number: IPCOM000007312D
Publication Date: 2002-Mar-13

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for the use of an autoclave for improved wafer bonding and increased manufacturing throughput. Benefits include improved reliability, reduced defects, and improved throughput.