Browse Prior Art Database

RF POWER MODULE UTILIZING SURFACE MOUNT TECHNOLOGY

IP.com Disclosure Number: IPCOM000007348D
Original Publication Date: 1995-Mar-01
Included in the Prior Art Database: 2002-Mar-18

Publishing Venue

Motorola

Related People

Authors:
Robert A. Richter Jr.

Abstract

There have always been performance and man- ufacturing trade offs with RF power amplifier mod- ules. Older module designs have power devices with heat spreading flanges that require direct mounting to the heat sink. These modules also have horizon- tal blade like leads extruding from the side of the device as the electrical interconnects to the module. These devices are known as standard packages.