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60 DEGREE BEVEL GaAs DICING PROCESS Disclosure Number: IPCOM000007397D
Original Publication Date: 1995-Mar-01
Included in the Prior Art Database: 2002-Mar-21

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Todd Snider


As a result of the need for an improved GaAs The process consists of two steps. The first step wafer dicing process in CS-1, the 60 degree bevel utilizes a 60 degree beveled saw blade to remove the process has been successfully developed. Significant top layer of material from the saw street. The sec- improvements in throughput and cut quality have ond step utilizes a standard type saw blade, centered been demonstrated on CS-l's GaAs products. within the bevel kerf, to cut through the remaining material. The result is a die which has a 30 degree beveled edge around it's upper circumference.