60 DEGREE BEVEL GaAs DICING PROCESS
Original Publication Date: 1995-Mar-01
Included in the Prior Art Database: 2002-Mar-21
As a result of the need for an improved GaAs The process consists of two steps. The first step wafer dicing process in CS-1, the 60 degree bevel utilizes a 60 degree beveled saw blade to remove the process has been successfully developed. Significant top layer of material from the saw street. The sec- improvements in throughput and cut quality have ond step utilizes a standard type saw blade, centered been demonstrated on CS-l's GaAs products. within the bevel kerf, to cut through the remaining material. The result is a die which has a 30 degree beveled edge around it's upper circumference.