Browse Prior Art Database

KNOWN GOOD DIE TEST FOR C4 (or other) BUMPED DIE

IP.com Disclosure Number: IPCOM000007453D
Original Publication Date: 1995-Jul-01
Included in the Prior Art Database: 2002-Mar-27
Document File: 4 page(s) / 183K

Publishing Venue

Motorola

Related People

Authors:
Eric Hubacher

Abstract

In recent years, there has been a significant increase in the demand for semiconductor suppliers to provide bare (unpackaged) die to assembly houses for attachment to multichip modules and directly to organic carriers (printed circuit boards). This require- ment is drawing a critical need for till hmctional electrical testing (including high and low tempera- ture conditions) and burn-in of bare die to insure assembly yields and to reduce early life reliability failures ofthe silicon.