KNOWN GOOD DIE TEST FOR C4 (or other) BUMPED DIE
Original Publication Date: 1995-Jul-01
Included in the Prior Art Database: 2002-Mar-27
In recent years, there has been a significant increase in the demand for semiconductor suppliers to provide bare (unpackaged) die to assembly houses for attachment to multichip modules and directly to organic carriers (printed circuit boards). This require- ment is drawing a critical need for till hmctional electrical testing (including high and low tempera- ture conditions) and burn-in of bare die to insure assembly yields and to reduce early life reliability failures ofthe silicon.