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Full Phase Mask in Damascene Process Disclosure Number: IPCOM000007569D
Publication Date: 2002-Apr-05

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To provide optimal printing resolution, a full phase PSM mask can be used in a Damascene process. One feature of this full phase PSM is shifter cutting at corners, wherein a cut can be made in a shifter at the corner and the phase of one shifter segment can be switched. Another feature of this full phase PSM is the use of negative tone resist for the wafer.