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Heat Spreader in Array Design to Minimize Processing Time

IP.com Disclosure Number: IPCOM000007584D
Original Publication Date: 2002-Apr-08
Included in the Prior Art Database: 2002-Apr-08

Publishing Venue

Motorola

Related People

Authors:
R.Ibrahim LC Tan KH Tan Calvin Lo

Abstract

Traditionally, integrated heat spreaders are attached to the individual units one-by-one either manually or by pick and place equipment. This method is time consuming, and for array packages such as MAP BGA and QFN, the time taken for this method would depend on the number of units on each panel. The new method introduced here is that heat spreaders are made in array (panel) format, which can be gang-attached to the panels prior to package encapsulation. Separation of the heat spreader units occurs when panels are sawn into individual (singulated) units. This method significantly reduces processing time and simplifies the handling of heat spreaders, which is similar to handling of substrate panels or leadframes.